What is an SOIC package?

The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to dissipate heat.

What is the difference between SSOP and Tssop?

SSOP package having leads in two side of periphery and having lead pitch less than 1.0mm, said package named Shrink Small Outline Package. TSSOP package having an encapsulant width less than 300mils covering entire package, having total height less than 1.2mm, said package named Thin Shrink Small Outline Package.

What are the different IC packages?

Through-hole packages.
Surface mount.
Chip carrier.
Pin grid arrays.
Flat packages.
Small outline packages.
Chip-scale packages.
Ball grid array.

What is SOIC and PDIP?

SOIC is surface mount – it has flat contact pins and is tiny. PDIP is through hole mount- it has bent pins, designed for inserting into IC sockets and such. You want the latter.

What is SON package?

Small Outline No Lead (SON) packages provide a small form factor at 0.4 and 0.5mm pitch. These are normally smaller pincount devices in a robust, plastic package compatible with all end equipment including automotive. Quad lead version is referred to as QFN.

What is SOT package?

A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor commonly used in consumer electronics. The most common SOT are SOT23 variations, also manufacturers offer the nearly identical thin small outline transistor (TSOT) package, where lower height is important.

What is the purpose of SSOPs?

Sanitation Standard Operating Procedures (SSOPs) are detailed procedures specifying what to clean, how to clean, how often to clean, and the records used for monitoring.

Are SOP and SOIC the same?

SOP (JEITA/EIAJ) These are sometimes called “wide SOIC”, as opposed to the narrower JEDEC MS-012, but they in turn are narrower than the JEDEC MS-013, which may also be called “wide SOIC”.

What is the most popular form of the IC package?

4. What is the most popular form of the IC package?

Flatpack.
DIL.
TO-5.
All of the above.

What are the three basic types of linear IC packages?

IC packages can be grouped into three general categories; Dual In-line Packages, Chip Carriers and Grid Arrays. All the packages, regardless of the category has a body style that scales with pin count.

What is a sop chip?

This can be called horizontal or two-dimensional (2-D) integration of IC blocks in a single-chip toward end-product systems. There is a new emerging concept called system-on-package (SOP). With SOP, the package, not the board, is the system.

What is the difference between QFN and DFN?

The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN. Because the DFN has no leads and has shorter bond wire lengths, it provides a higher electrical performance than leaded packages due to less inductance.

How big is the SSOP Small OutliNe package?

SSOP lead counts range from 8 to 64. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm. The SSOP package is JEDEC- and EIAJ- compliant. SSOP’s have solder-plated gull-wing leads that are protruding from the longer sides of the package.

Which is smaller the SOIC or the shrink Small OutliNe package?

The Shrink Small Outline Package, or SSOP, is a smaller or ‘shrunk’ version of the SOIC package, having a compressed body and a tightened lead pitch.

Which is a smaller version of the SOIC?

The Very Small Outline Package, or VSOP, is one of several smaller versions of the SOIC package, having a compressed body and a tightened pitch for its gull wing leads. Another smaller version of the SOIC is the SSOP. Typical V SOP lead counts range from 8 to 40.

Which is the best package for SOIC components?

Conveniently, the SOIC will generally be offered for the components that also come in DIP packages which offered the flexibility of prototyping on a breadboard or a protoboard. This package is also a great choice for making a finished product with. TSOP: This package is the Thin Small Outline Package.

What is an SOIC package? The SOIC is a surface mount integrated circuit package. The standard form is a flat rectangular body, with leads extending from two sides. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. The pad can be soldered to the PCB to…